? semiconductor components industries, llc, 2012 november, 2012 ? rev. 5 1 publication order number: mbr140sft1/d mbr140sf, nrvb140sf surface mount schottky power rectifier plastic sod ? 123 package this device uses the schottky barrier principle with a large area metal ? to ? silicon power diode. ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. this package also provides an easy to work with alternative to leadless 34 package style. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac ? dc and dc ? dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? guardring for stress protection ? low forward voltage ? 125 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? package designed for optimal automated board assembly ? esd rating: ? human body model = 3b ? machine model = c ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? these devices are pb ? free and are rohs compliant* mechanical characteristics ? device marking: l4f ? polarity designator: cathode band ? weight: 11.7 mg (approximately) ? case: epoxy, molded ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information sod ? 123fl case 498 plastic schottky barrier rectifier 1.0 amperes 40 volts http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. marking diagram l4f = specific device code m = date code = pb ? free package) l4f m mbr140sft3g sod ? 123fl (pb ? free) 10,000 / tape & reel *** MBR140SFT1G sod ? 123fl (pb ? free) 3,000 / tape & reel ** (note: microdot may be in either location) nrvb140sft1g sod ? 123fl (pb ? free) 3,000 / tape & reel ** nrvb140sft3g sod ? 123fl (pb ? free) 10,000 / tape & reel *** ** 8 mm tape, 7? reel *** 8 mm tape, 13? reel
mbr140sf, nrvb140sf http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 40 v average rectified forward current (at rated v r , t l = 112 c) i o 1.0 a peak repetitive forward current (at rated v r , square wave, 100 khz, t l = 95 c) i frm 2.0 a non ? repetitive peak surge current (non ? repetitive peak surge current, halfwave, single phase, 60 hz) i fsm 30 a storage temperature t stg ? 55 to 150 c operating junction temperature t j ? 55 to 125 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (note 1) thermal resistance, junction ? to ? lead (note 2) thermal resistance, junction ? to ? ambient (note 1) thermal resistance, junction ? to ? ambient (note 2) r tjl r tjl r tja r tja 26 21 325 82 c/w 1. mounted with minimum recommended pad size, pc board fr4. 2. mounted with 1 in. copper pad (cu area 700 mm 2 ). electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 3), see figure 2 v f t j = 25 c t j = 85 c v (i f = 0.1 a) (i f = 1.0 a) (i f = 3.0 a) 0.36 0.55 0.85 0.30 0.515 0.88 maximum instantaneous reverse current (note 3), see figure 4 i r t j = 25 c t j = 85 c ma (v r = 40 v) (v r = 20 v) 0.5 0.15 25 18 3. pulse test: pulse width 250 s, duty cycle 2%.
mbr140sf, nrvb140sf http://onsemi.com 3 i f , instantaneous forward current (amps) i f , instantaneous forward current (amps) figure 1. typical forward voltage figure 2. maximum forward voltage 0.1 v f , instantaneous forward voltage (volts) 10 1.0 v f , maximum instantaneous forward voltage (volts) 0.1 0.7 0.3 0.5 0.9 t j = 85 c t j = 125 c t j = ? 40 c t j = 25 c 100 0.1 10 1.0 0.1 0.7 0.3 0.5 0.9 t j = 85 c t j = 125 c t j = 25 c i r , maximum reverse current (amps) i r , reverse current (amps) figure 3. typical reverse current figure 4. maximum reverse current 40 0 v r , reverse voltage (volts) 100e ? 3 10e ? 3 1.0e ? 3 100e ? 6 10e ? 6 1.0e ? 6 v r , reverse voltage (volts) 10 20 30 40 0 1.0e+0 100e ? 6 10e ? 6 10 20 30 t j = 125 c t j = 85 c t j = 25 c t j = 85 c t j = 25 c 100e ? 3 10e ? 3 1.0e ? 3 p fo , average power dissipation (watts) i pk /i o = 5 figure 5. current derating i o , average forward current (amps) 0.2 0 1.0 0.6 0.5 0.3 0.1 0 1.0 0.4 0.8 1.2 1.6 0.4 square wave dc i pk /i o = i pk /i o = 10 i pk /i o = 20 0.6 1.4 0.2 0.7 0.8 0.9 figure 6. forward power dissipation i o , average forward current (amps) i pk /i o = 5 t l , lead temperature ( c) 35 25 1.8 1 0.8 0.4 0.2 0 75 45 65 85 125 0.6 square wave dc i pk /i o = i pk /i o = 10 i pk /i o = 20 55 115 1.2 1.4 1.6 95 105 freq = 20 khz
mbr140sf, nrvb140sf http://onsemi.com 4 figure 7. capacitance t j , derated operating temperature ( c) figure 8. typical operating temperature derating* 30 0 v r , dc reverse voltage (volts) 125 65 55 15 510 2025 40 35 c, capacitance (pf) 30 0 v r , reverse voltage (volts) 1000 100 10 15 510 2025 t j = 25 c 40 35 75 85 95 105 115 r ja = 25.6 c/w 130 c/w 235 c/w 324.9 c/w * reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re- verse voltage conditions. calculations of t j therefore must include forward and reverse power effects. the allowable operating t j may be calculated from the equation: t j = t jmax ? r(t)(pf + pr) where r(t) = thermal impedance under given conditions, pf = forward power dissipation, and pr = reverse power dissipation this graph displays the derated allowable t j due to reverse bias under dc conditions only and is calculated as t j = t jmax ? r(t)pr, where r(t) = rthja. for other power applications further calculations must be performed. r(t), transient thermal resistance figure 9. thermal response 1000 0.1 0.00001 t 1 , time (sec) 1000 1 0.0001 0.001 0.01 1 10 100 0.000001 0.1 10 100 p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 ja = 321.8 c/w test type > min pad < die size 38x38 @ 75% mils d = 0.5 single pulse 0.2 0.1 0.05 0.01
mbr140sf, nrvb140sf http://onsemi.com 5 package dimensions sod ? 123fl case 498 issue b notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold flash. 4. dimensions d and j are to be measured on flat section of the lead: between 0.10 and 0.25 mm from the lead tip. d e b a a1 l c polarity indicator optional as needed h e dim a min nom max min millimeters 0.90 0.95 1.00 0.035 inches a1 0.00 0.05 0.10 0.000 b 0.70 0.90 1.10 0.028 c 0.10 0.15 0.20 0.004 d 1.50 1.65 1.80 0.059 e 2.50 2.70 2.90 0.098 l 0.55 0.75 0.95 0.022 0.037 0.039 0.002 0.004 0.035 0.043 0.006 0.008 0.065 0.071 0.106 0.114 0.030 0.037 nom max 3.40 3.60 3.80 0.134 0.142 0.150 h e ? ? 0 8 0 8 mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbr140sft1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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